Arteris to Expand Portfolio with Acquisition of Cycuity, a Leader in Semiconductor Cybersecurity Assurance

Arteris Selected by Black Sesame Technologies for Next Generation of Intelligent Driving Silicon

Blaize Deploys Arteris NoC IP to Power Scalable, Energy-Efficient Edge AI Solutions

Arteris Selected by Altera to Advance Intelligent Computing Across Cloud-to-Edge Applications

Arteris Selected by Axelera AI to Accelerate Computer Vision for Edge Devices

Arteris and Alibaba DAMO Academy Extend Partnership to Accelerate High-Performance RISC-V SoC Designs

Arteris Selected by 2V Systems for IO Chiplet for Data Center

Arteris Selected by NanoXplore for Space Applications

Omni Design Technologies Tapes Out Ultra-High-Speed 64GSPS ADC on TSMC N3 process

Omni Design Technologies Secures over $35 Million in Series A Funding to Advance Its Leadership in Wideband Signal Processing™ for the AI Data Revolution

Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor

Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications

Omni Design Technologies Extends Swift™ Data Converter Solutions for FR1 and FR2 5G Subsystems  

Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio

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Codasip enables secure Linux by donating CHERI RISC-V SDK to the CHERI Alliance

Codasip unveils versatile automotive-grade embedded RISC-V core

Codasip introduces best-in-class RISC-V core for power-efficient applications

embedded world 2024: Codasip demonstrates CHERI memory protection

Codasip achieves certification for automotive functional safety and cybersecurity

Codasip delivers processor security to actively prevent the most common cyberattacks

Movellus Debuts Industry-First On-Die Power Delivery Network Analyzer

Movellus and RTX’s SEAKR Engineering Collaborate on Advancing Mission-Critical ASICs

Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions

Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem

Movellus Introduces Aeonic Power™ Product Family for On-Die Voltage Regulation

Movellus Extends Droop Management Leadership with Aeonic Generate™ AWM3

Movellus Introduces Aeonic Insight™ Product Line for On-die Telemetry

Movellus Delivers Clock Generation Module on 3nm Process

Faraday Signed Renewable Energy Procurement Agreement for Net-zero Carbon Emission

Faraday Unveils HiSpeedKit™-HS Platform for High-speed Interface IP Verification in SoCs

Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production

Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis

Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets

Faraday Adds Video Interface IP to Support All Advanced Planar Nodes on UMC Platform

Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications

Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024

Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs

Faraday Partnered with SONIX to Create a New Product Featuring Its SONOS eFlash Solutio