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  • Faraday Signed Renewable Energy Procurement Agreement for Net-zero Carbon Emission

  • Faraday Unveils HiSpeedKit™-HS Platform for High-speed Interface IP Verification in SoCs

  • Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production

  • Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis

  • Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets

  • Faraday Adds Video Interface IP to Support All Advanced Planar Nodes on UMC Platform

  • Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications

  • Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024

  • Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs

  • Faraday Partnered with SONIX to Create a New Product Featuring Its SONOS eFlash Solutio

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