Arteris Deployed by Menta for Edge AI Chiplet Platform

Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards

Arteris and MIPS Partner on High-Performance RISC-V SoCs for Automotive, Datacenter and Edge AI

Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions

Arteris Selected by TIER IV for Intelligent Vehicles

Arteris and SiFive Deliver Pre-verified Solution for the Datacenter Market

Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications

Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio

Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar

Omni Design Technologies Named Winner of the TiE50 Award and TiE50 Showcase Judges Choice Award

Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance

Omni Design Technologies to attend TSMC 2024 Japan Technology Symposium 28th June, 2024 Yokohama

Omni Design Technologies to attend TSMC 2024 China Technology Symposium 28th May, 2024 Shanghai

Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions

Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters

Codasip enables secure Linux by donating CHERI RISC-V SDK to the CHERI Alliance

Codasip unveils versatile automotive-grade embedded RISC-V core

Codasip introduces best-in-class RISC-V core for power-efficient applications

embedded world 2024: Codasip demonstrates CHERI memory protection

Codasip achieves certification for automotive functional safety and cybersecurity

Codasip delivers processor security to actively prevent the most common cyberattacks

Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions

Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem

Movellus Introduces Aeonic Power™ Product Family for On-Die Voltage Regulation

Movellus Extends Droop Management Leadership with Aeonic Generate™ AWM3

Movellus Introduces Aeonic Insight™ Product Line for On-die Telemetry

Movellus Delivers Clock Generation Module on 3nm Process

Faraday Signed Renewable Energy Procurement Agreement for Net-zero Carbon Emission

Faraday Unveils HiSpeedKit™-HS Platform for High-speed Interface IP Verification in SoCs

Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production

Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis

Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets

Faraday Adds Video Interface IP to Support All Advanced Planar Nodes on UMC Platform

Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications

Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024

Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs

Faraday Partnered with SONIX to Create a New Product Featuring Its SONOS eFlash Solutio